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Ball Grid Arrays
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Motorola's Application Note 1231
Motorola Probably the best on-line document about BGA assembly and design 
Tutorial: Soldering Flip Chip and BGA Packages Chip Scale Review Magazine The selection of solder, always an important issue, is particularly critical with flip chip and other miniature leadless packages, where the solder plays an increased structural role. Article by Mike Fenner, Indium Corp. Europe, London
BGA Reliability Characterization Project Temperature Cycling Tests Final Report HDP User Group International, Inc. This paper describes the investigation into the effects of temperature cycling of solder joint connections on the board level for a variety of ball grid array packages (BGA). Variables studied were package construction, package location on the circuit board, solder joint location on the package, and virgin versus reworked boards. Temperature cycle evaluations were conducted with real-time event monitoring and failed sites were subjected to failure analysis to determine cause of failure. The BGA Reliability Characterization Project Team performed this work, as part of the BGA Reliability Characterization Project of the HDP User Group (High Density Packaging User Group)
BGA Land Pattern Planning SMT Magazine Article about defining landpatterns for Ball Grid Arrays
Assembly with Intel Components: Rework Practices The technology and process knowledge to effectively and efficiently repair BGAs already exists. An added attraction for BGA packages is that they are compatible with existing surface mount technology (SMT) assembly processes and equipment, so rework is fairly simple. To learn more about BGA rework practices, see: Preparing PCBs and Packages for Rework BGA Removal/Placement Cleaning Devices and Board After Removal BGA Re-balling Kits Solder Spheres µBGA On-Board BGA Test Sockets Socket Preparation Solder Paste Application Socket Placement Socket Reflow BGA Reflow Profiles
Ball Grid Array Technology IVF (The Swedish Institute of Production Engineering Research) Good introduction to Ball Grid Array Technology by IVF (The Nordic Electronics Packaging Guideline)
Reducing Solder Voids with Copper-Filled Microvias Circuits Assembly A study was done to determine the effect of via filling on void formation in solder joints. The study compared conformal copper plating to partial and full via filling with copper. Different solder paste chemistries and reflow profiles were selected to provide a range of potential solder voids. Both cross section and x-ray analysis were performed to measure void size, occurrence and location. (added on 13-Apr-2003)
Assembly of Large PBGAS on Printed Circuit Board with Large PQFPS Directly on the Opposite Side Journal Of Electronics Manufacturing A two-side no-clean mass reflow process for large plastic ball grid array (PBGA) and plastic quad flat pack (PQFP) packages is presented. Emphasis is placed on the PBGA and PQFP assembly parameters such as the design, materials, and process of the packages and printed circuit board (PCB), solder paste, stencil printing, pick and place, reflow, and inspection. Solder joint reliability of the two-side PCB assembly is evaluated by shear tests and thermal cycling tests.
Ball Grid Array Technology IVF (The Swedish Institute of Production Engineering Research) Part#2 of IVF's introduction to Ball Grid Array Technology
Waste Not, Want Not Circuits Assembly Simplify BGA rework by reusing leftover solder. (added on 13-Apr-2003)
3-D Measurement System for Use in Microelectronics Advanced Packaging A study of the relationship between warp of BGA's and solder joint reliability, demonstrating a method to measure warping. (added on 15-Nov-2003)
Soldermask Registration Considerations for Fine-Pitch Area Array Package Assembly SMT Magazine This articles explains how solder mask registration can cause shorts when soldering fine-pitch BGA's or CSP's, and it provides some tips on how to avoid such problems. I believe it's just about a week ago that I experienced exactly this same problem, so you'd better read this article before it happens to you ! (added on 31-Mar-2004)
Array Packages Electronic Production Electronics Production Magazine does not exist anymore, but their extremely usefull online-encyclopedia is still available from SMTinfo.net. This part gives an introduction to BGA's and other array packages.
Underfill Effects on BGA Drop, Bend, and Thermal Cycle Tests Advanced Packaging The use of a properly designed underfill can significantly improve drop and bend tests, and the thermal cycle performance of BGAs. (added on 06-Mar-2005)
BGA LAND PATTERN and ASSEMBLY Issues PCD&M Magazine While saving plenty in board real estate, BGAs and chip-scale packages carry a host of other considerations, from coplanarity to rework to reliability. (added on 07-Feb-2004)
Bga Rework: A Comparitive Study Of Selective Solder Paste Deposition For Area Array Packages BEST Solder paste or flux paste, that's the question. This paper introduces a new method with a "remain in place" semi-permanent stencil. (added on 04-May-2004)
Land Patterns for BGA Packages Printed Circuit Design & Manufacture Routing, spacing and soldermask requirements for coarse- and fine-pitch ball grid arrays. (added on 23-May-2004)
Strain Gage Testing: Predicting and Preventing Brittle Fracture of BGAs SMT Magazine Article that promotes a new type of test, called Strain Gage Testing, as a method to determine whether a particular process step is exerting excessive strain on a BGA. (added on 27-Jun-2004)
Investigating Voids Circuits Assembly Investigations in the amount of voiding for various conductor finishes.It is concluded that the void profile of tin, silver and HASL is much smaller than for ENIG, possibly making these pad finishes more suitable for lead-free assembly. (added on 27-Jun-2004)
Lead-Free BGA Assembly Assembly Magazine Could a flip-chip ball-grid array (FCBGA) with 780 I/O be successfully assembled with lead-free solder at a peak reflow temperature below 260 C? How would lead-free solder affect joint reliability? How would it affect rework? A study was conducted to find out. (added on 07-Aug-2004)
Solder Vendors: Voiding Doesn't Affect Joint Reliability Circuits Assembly Thursday, 15 December 2005 : BANNOCKBURN, IL – A group of leading solder vendors today issued a statement asserting “no evidence” exists demonstrating voiding has “any significant impact” on solder joint reliability. (added on 18-Dec-2005)
Troubleshooting Underfill Void Elimination Advanced Packaging This article explores strategies for troubleshooting void problems in underfills. (added on 18-Sep-2005)
A Proposed Remedy for Ball-in-Socket Defects SMT Magazine This article covers several commonly proposed root causes of ball-in-socket defects, and the use of an experimental reflow profile to solve these defects. (added on 24-Jul-2006)
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© 2004 Daan Terstegge - All rights reserved. |