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Reliability of Multilayer Ceramic Capacitors After Thermal Shock
AVX Corporation
With increasing use of multilayer ceramic capacitors in surface mount applications, the understanding of thermal shock properties of these devices is becoming increasingly important. Of the various soldering techniques utilized in surface mount applications, including wave soldering imposes the most severe thermal stresses on the MLCs. To simulate this process, parts are often dipped in solder baths. It will be shown in this paper that properties like critical stress intensity factor K1C, thermal diffusivity, Young's modules and the chip geometry are important for understanding the thermal shock behavior of chips. Examples of the effects of K1c and chip geometryare shown. 
(added on 14-Sep-2003)   

Parameters Important For Surface Mount Applications Of Multilayer Ceramic Capacitors
AVX Corporation
This paper gives insight into the mechanical properties and thermal stress resistance parameters of multilayer ceramic capacitors, which is essential for zero defect soldering and sub ppm failure rates. 
(added on 20-Jul-2003)   

 

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Capacitor Aging
Article about aging of capacitors 


CapSite 2002
Introduction To Capacitors 


Mechanical Strength Properties of Multilayer Chip Capacitors
KEMET
In this PDF-document the mechanical strength of multilayer ceramic chip capacitors are examined. The importance of test methods and parameters such as sample size, calculation of data, and test fixtures are adressed. Research data are presented which relate strength to process and material characteristics.  


Ceramic Capacitors
 


Reliability of Multilayer Ceramic Capacitors After Thermal Shock
AVX Corporation
With increasing use of multilayer ceramic capacitors in surface mount applications, the understanding of thermal shock properties of these devices is becoming increasingly important. Of the various soldering techniques utilized in surface mount applications, including wave soldering imposes the most severe thermal stresses on the MLCs. To simulate this process, parts are often dipped in solder baths. It will be shown in this paper that properties like critical stress intensity factor K1C, thermal diffusivity, Young's modules and the chip geometry are important for understanding the thermal shock behavior of chips. Examples of the effects of K1c and chip geometryare shown. 
(added on 14-Sep-2003)   


Parameters Important For Surface Mount Applications Of Multilayer Ceramic Capacitors
AVX Corporation
This paper gives insight into the mechanical properties and thermal stress resistance parameters of multilayer ceramic capacitors, which is essential for zero defect soldering and sub ppm failure rates. 
(added on 20-Jul-2003)   


Electrolytic Capacitors
 


 


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