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Pin In Paste Soldering
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White Papers and Technical Reports
Universal Instruments A collection of technical papers to help you keep up with this ever-evolving industry. They cover the following topics: Flip Chip and Die Placement Chip Scale Package (CSP) Circuit Board Technology Optoelectronics Pin-in-Paste 0201 Electrostatic Discharge (ESD) Adhesives and Dispensing Business and Operations 
Pin in paste Bob Willis Homepage
Pin In Hole Reflow F.A.Q.'s Bob Willis Homepage Small page with the answers to Frequently Asked Questions about the Pin-in-paste technique
Solder Volumes for Through-Hole Reflow-Compatible Connectors AMP / Tyco Electronics Calculations for determining the amount of solder paste needed to have good results with the pin-in-paste process
Practical Tips for Implementing the Pin-in-Paste Process Assembly Magazine This article should give readers reasonable starting points for the pin-in-paste process, discussing stencil design, printing, component concerns and reflow. (added on 04-Mar-2003)
Intrusive Reflow Calculator Ioan Tempea Here's an Excel-sheet made by Ioan Tempea of Positron Technologies to help optimize the parameters that determine hole-fill at pin-in-paste soldering. (added on 12-Oct-2003)
Step 6: Component Placement SMT Magazine Introduction to integrating through-hole connectors in the SMT process. (added on 27-Jun-2004)
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© 2004 Daan Terstegge - All rights reserved. |