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Reballing
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Assembly with Intel Components: Rework Practices
The technology and process knowledge to effectively and efficiently repair BGAs already exists. An added attraction for BGA packages is that they are compatible with existing surface mount technology (SMT) assembly processes and equipment, so rework is fairly simple. To learn more about BGA rework practices, see: Preparing PCBs and Packages for Rework BGA Removal/Placement Cleaning Devices and Board After Removal BGA Re-balling Kits Solder Spheres µBGA On-Board BGA Test Sockets Socket Preparation Solder Paste Application Socket Placement Socket Reflow BGA Reflow Profiles 
Solutions for Advanced Rework Challenges SMT Magazine (October 2005) cover story. Discusses solutions for today's latest rework challenges, including: small passives, single-ball reballing, stacked die, using integrated dispense, terhmal management, accuracy issues and lead-free. (added on 22-Jan-2006)
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© 2004 Daan Terstegge - All rights reserved. |