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Solderballing
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Solder Balls
Amtech Solder Products, Inc Discussion about the two types of solderballs, why they are formed and what can be done to prevent them. 
Solder Beading in SMT: Causes and Cures AIM Abstract: Solder beading is an SMT defect that may be caused by several contributing factors. In nearly every case, however, solder beading may be substantially reduced or eliminated by reducing the volume of solder paste deposited on the PCB. In addition, the location of the solder paste on the pad is of critical importance. This paper describes the common causes of the solder beading phenomenon and details the cures for each of these.
Matte-surface solder masks reduce solder ball defects TKB-4U This article provides a short description of the influence of surface liquid photoimageable solder masks on the number of solder balls remaining on printed circuit boards processed with no-clean flux. (added on 19-Sep-2003)
Capillary Balls: Causes and Countermeasures Advanced Packaging How solder paste properties influence the amount of solder beading. (added on 11-Dec-2004)
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© 2004 Daan Terstegge - All rights reserved. |